[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Study on 3D stack package with anodic alumina substrate
Luo, Yan, Wang, Lichun, Liu, Mifeng, Zhao, Yong, Wu, Weiwei, Ren, WeipengYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480657
File:
PDF, 4.66 MB
english, 2018