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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Thermal Stress Analysis of BGA Solder Joint Power Load Based on COMSOL
Wang, Jian-pei, Lu, Liang-kun, Huang, Chun-yue, Wei, HeYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480783
File:
PDF, 4.55 MB
english, 2018