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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Fabrication of oxidation-resistant submicron copper particles and the conductive ink as well as its sintering behavior on the flexible substrate
Huang, Hai-Jun, Zhou, Min-Bo, Yin, Can, Chen, Qi-Wang, Zhang, Xin-PingYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480671
File:
PDF, 7.30 MB
english, 2018