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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Design and development of power module co-packaged with SiC GTO and SiC PiN
Yang, Yingkun, Gao, Lei, Li, Zhiqiang, Zhou, Kun, Zhang, Lin, Zhang, Long, Li, Juntao, Mei, YunhuiYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480708
File:
PDF, 4.21 MB
english, 2018