[IEEE 2018 19th International Conference on Electronic...

  • Main
  • [IEEE 2018 19th International...

[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Design and development of power module co-packaged with SiC GTO and SiC PiN

Yang, Yingkun, Gao, Lei, Li, Zhiqiang, Zhou, Kun, Zhang, Lin, Zhang, Long, Li, Juntao, Mei, Yunhui
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480708
File:
PDF, 4.21 MB
english, 2018
Conversion to is in progress
Conversion to is failed