[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Influence of solder ball volume on mechanical shock reliability of right-angle solder interconnects
Yue, Wu, Zhou, Min-Bo, Zhang, Xin-PingYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480750
File:
PDF, 5.92 MB
english, 2018