[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Ultrasonic-assisted soldering of SAC0307 solder with Nano-particles active-flux
Xia, Da-quan, Yang, Dong-hua, Liu, Xin, Zhou, Yu-feng, Gan, Gui-sheng, Wu, Yi-pingYear:
2018
Language:
english
DOI:
10.1109/icept.2018.8480589
File:
PDF, 8.88 MB
english, 2018