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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Research on Key Process Technology of RDL-first Fan-out Wafer Level Packaging
Zhu, Jiachang, Ming, Xuefei, Yao, XinYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480571
File:
PDF, 4.18 MB
english, 2018