[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - A Risk Assessment Method for Void in SnAg Solder Bump Influence on Reliability of Flip Chip Packaging
Chen, Jun, Hu, Anmin, Long, Xinjiang, Li, MingYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480578
File:
PDF, 5.21 MB
english, 2018