Improvement in Thermomechanical Reliability of Low Cost...

Metals 2018 / 07 Vol. 8; Iss. 8

Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition

Bang, Junghwan, Yu, Dong-Yurl, Yang, Ming, Ko, Yong-Ho, Yoon, Jeong-Won, Nishikawa, Hiroshi, Lee, Chang-Woo
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
8
Language:
english
Journal:
Metals
DOI:
10.3390/met8080586
Date:
July, 2018
File:
PDF, 5.24 MB
english, 2018
Conversion to is in progress
Conversion to is failed