[IEEE 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2018.7.16-2018.7.19)] 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Failure Analysis Case Studies on Wafer Edge Failure due to Process Uniformity Issue
Xu, N.Y., Ng, H.P., Ang, G.B., Chen, C.Q., Teo, A., Jerome, A., Tam, Y.S, Li, Y., Mai, Z.H.Year:
2018
Language:
english
DOI:
10.1109/IPFA.2018.8452549
File:
PDF, 825 KB
english, 2018