[ASME ASME 2003 International Mechanical Engineering Congress and Exposition - Washington, DC, USA (November 15–21, 2003)] Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology - Thermal Model of a Thinned-Die Cooling System
Boiadjieva, N., Koev, P.Volume:
2003
Year:
2003
Language:
english
DOI:
10.1115/IMECE2003-42034
File:
PDF, 258 KB
english, 2003