Charge transport model to predict dielectric breakdown as a function of voltage, temperature, and thickness
Ogden, Sean P., Xu, Yueming, Yeap, Kong Boon, Shen, Tian, Lu, Toh-Ming, Plawsky, Joel L.Volume:
91
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.10.005
Date:
December, 2018
File:
PDF, 1.16 MB
english, 2018