![](/img/cover-not-exists.png)
[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - A new multi-layer AiP solution based on organic substrate
Zhou, Shengjuan, Cai, Jian, Wang, Qian, Chen, Yu, Zhang, XuesongYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480655
File:
PDF, 4.13 MB
english, 2018