Working mechanism of iodide ions and its application to Cu...

Electrochimica Acta 2019 / 02 Vol. 295

Working mechanism of iodide ions and its application to Cu microstructure control in through silicon via filling

Sung, MinJae, Kim, Sang-Hyeok, Lee, Hyo-Jong, Lim, Taeho, Kim, Jae Jeong
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Volume:
295
Language:
english
Journal:
Electrochimica Acta
DOI:
10.1016/j.electacta.2018.10.141
Date:
February, 2019
File:
PDF, 1.79 MB
english, 2019
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