Influence of additives on electroplated copper films and...

Materials Characterization 2019 / 01 Vol. 147

Influence of additives on electroplated copper films and their solder joints

Lee, Hsuan, Tsai, Shan-Ting, Wu, Ping-Heng, Dow, Wei-Ping, Chen, Chih-Ming
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Volume:
147
Language:
english
Journal:
Materials Characterization
DOI:
10.1016/j.matchar.2018.10.029
Date:
January, 2019
File:
PDF, 2.59 MB
english, 2019
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