Study on the deformation mechanism of spherical diamond...

Materials Science in Semiconductor Processing 2019 / 02 Vol. 90

Study on the deformation mechanism of spherical diamond indenter and its influence on 3C-SiC sample during nanoindentation process via molecular dynamics simulation

Zhu, Bo, Zhao, Dan, Tian, Yuan, Wang, Shunbo, Zhao, Hongwei, Zhang, Jianhai
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Volume:
90
Language:
english
Journal:
Materials Science in Semiconductor Processing
DOI:
10.1016/j.mssp.2018.10.016
Date:
February, 2019
File:
PDF, 2.62 MB
english, 2019
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