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Thermal and mechanical properties of micro Cu doped Sn58Bi solder paste for attaching LED lamps
Zhang, Hao, Sun, Fenglian, Liu, YangLanguage:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-018-0298-0
Date:
November, 2018
File:
PDF, 2.08 MB
english, 2018