Thermal Resistance Evaluation of a Low-Inductance...

ECS Transactions 2018 / 07 Vol. 86; Iss. 12

Thermal Resistance Evaluation of a Low-Inductance Double-Stacked SiN-AMC Substrate for a High-Temperature Operation SiC Power Module

Kato, Fumiki, Sato, Shinji, Tanisawa, Hidekazu, Koui, Kenichi, Watanabe, Kinuyo, Murakami, Yoshinori, Yamaguchi, Hiroshi, Sato, Hiroshi
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Volume:
86
Language:
english
Journal:
ECS Transactions
DOI:
10.1149/08612.0107ecst
Date:
July, 2018
File:
PDF, 306 KB
english, 2018
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