[IEEE 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2018.7.16-2018.7.19)] 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Electrical Characterization of FEOL Bridge Defects in Advanced Nanoscale Devices Using TCAD Simulations
Wei, Teo Chea, Narang, Vinod, Thean, AaronYear:
2018
Language:
english
DOI:
10.1109/IPFA.2018.8452518
File:
PDF, 744 KB
english, 2018