Effect of stand-off height on the shear strength of ball grid array solder joints under varying pad sizes
Ogunsemi, Bamidele T., Ikubanni, Peter P., Adediran, Adeolu A., Agboola, Olayinka O.Volume:
1
Language:
english
Journal:
SN Applied Sciences
DOI:
10.1007/s42452-018-0044-5
Date:
January, 2019
File:
PDF, 1.66 MB
english, 2019