Electrical characterization of epoxy-based molding...

Microelectronics Reliability 2018 / 09 Vol. 88-90

Electrical characterization of epoxy-based molding compounds for next generation HV ICs in presence of moisture

Cornigli, D., Reggiani, S., Gnudi, A., Gnani, E., Baccarani, G., Fabiani, D., Varghese, D., Tuncer, E., Krishnan, S., Nguyen, L.
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Volume:
88-90
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.07.030
Date:
September, 2018
File:
PDF, 407 KB
english, 2018
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