[IEEE 2017 21st European Microelectronics and Packaging...

  • Main
  • [IEEE 2017 21st European...

[IEEE 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Warsaw (2017.9.10-2017.9.13)] 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Thermal peak management using organic phase change materials for latent heat storage in electronic applications

Maxa, Jacob, Novikov, Andrej, Nowottnick, Mathias
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2017
Language:
english
DOI:
10.23919/EMPC.2017.8346849
File:
PDF, 1.13 MB
english, 2017
Conversion to is in progress
Conversion to is failed