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[IEEE 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Warsaw (2017.9.10-2017.9.13)] 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Thermal peak management using organic phase change materials for latent heat storage in electronic applications
Maxa, Jacob, Novikov, Andrej, Nowottnick, MathiasYear:
2017
Language:
english
DOI:
10.23919/EMPC.2017.8346849
File:
PDF, 1.13 MB
english, 2017