Thermal properties and applications of microencapsulated...

Applied Thermal Engineering 2019 / 01 Vol. 147

Thermal properties and applications of microencapsulated PCM for thermal energy storage: A review

Huang, Xiang, Zhu, Chuqiao, Lin, Yaxue, Fang, Guiyin
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Volume:
147
Language:
english
Journal:
Applied Thermal Engineering
DOI:
10.1016/j.applthermaleng.2018.11.007
Date:
January, 2019
File:
PDF, 2.90 MB
english, 2019
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