Fabrication and characterization of a low-cost interposer with an intact insulation layer and ultra-low TSV leakage current
Luo, Jiangbo, Wang, Guilian, Sun, Yunna, Zhao, Xiaolin, Ding, GuifuVolume:
28
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/1361-6439/aae8da
Date:
December, 2018
File:
PDF, 4.58 MB
english, 2018