[IEEE 2018 13th International Congress Molded Interconnect...

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[IEEE 2018 13th International Congress Molded Interconnect Devices (MID) - Würzburg, Germany (2018.9.25-2018.9.26)] 2018 13th International Congress Molded Interconnect Devices (MID) - The Potential of 3D-MID Technology for Omnidirectional Inductive Wireless Power Transfer

Sergkei, Kamotesov, Lombard, Philippe, Semet, Vincent, Allard, Bruno, Moguedet, Mael, Cabrera, Michel
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Year:
2018
Language:
english
DOI:
10.1109/ICMID.2018.8526962
File:
PDF, 1004 KB
english, 2018
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