Skin Effect Suppressed Ni-Fe/Cu Electroplated Multilayer...

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IEEE Transactions on Magnetics 2018

Skin Effect Suppressed Ni-Fe/Cu Electroplated Multilayer Wiring for High Data-Rate and Low Delay-Time I/O Interface Board

Yamaguchi, Masahiro, Yanai, Takeshi, Nakayama, Hidetoshi, Sai, Ranajit, Fujiwara, Hiroaki, Kitai, Yuki, Sato, Mikio, Sangawa, Ushio
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Year:
2018
Language:
english
Journal:
IEEE Transactions on Magnetics
DOI:
10.1109/TMAG.2018.2866126
File:
PDF, 981 KB
english, 2018
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