Fracture of Glass Seals in Surface Mount IC Packages
Stevens, Karl K., Wong, Tin-Lup, Renavikar, Ajit, Chen, WayneVolume:
112
Year:
1990
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2904357
File:
PDF, 1.34 MB
english, 1990