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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Simulation analysis of residual stress of BGA solder joints after reflow soldering based on element birth and death technology
Zhao, Sheng-jun, Huang, Chun-yue, Tang, Xiang-qiong, Lu, Liang-kunYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480531
File:
PDF, 3.63 MB
english, 2018