[IEEE 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2018.7.16-2018.7.19)] 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - A Novel Solution for Efficient in Situ TEM Cross-Section and Plan-View Analyses with An Advanced Sample Preparation Scheme
Peng, Kang-Ping, Hsu, Kim, Ger, Finn, Tsai, Tsung-ChangYear:
2018
Language:
english
DOI:
10.1109/IPFA.2018.8452550
File:
PDF, 963 KB
english, 2018