Observation of the Behavior of Additives in Copper Electroplating Using a Microfluidic Device
Akita, Takanori, Tomie, Mineyoshi, Ikuta, Ryo, Egoshi, Haruki, Hayase, MasanoriVolume:
166
Year:
2019
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/2.0081901jes
File:
PDF, 1.57 MB
english, 2019