![](/img/cover-not-exists.png)
[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Fabrication and characterization of nickel-gold plateble LTCC substrates based on borosilicate glass/Al2O3 system
huanhuan, Wan, weijun, Zhang, zhuofeng, LiuYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480794
File:
PDF, 4.15 MB
english, 2018