[IEEE 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2018.7.16-2018.7.19)] 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Investigation on the Vibration Amplitude of Au Bonding Wire Under Mechanical Shock
Wang, Zhibin, Xie, Chenming, Wang, Changcheng, Wang, XuYear:
2018
Language:
english
DOI:
10.1109/IPFA.2018.8452563
File:
PDF, 559 KB
english, 2018