Integration of Jet Impingement Cooling with Direct Bonded Copper Substrates for Power Electronics Thermal Management
Agbim, K., Pahinkar, D., Graham, S.Year:
2018
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2018.2863714
File:
PDF, 935 KB
english, 2018