[IEEE 2018 13th International Congress Molded Interconnect Devices (MID) - Würzburg, Germany (2018.9.25-2018.9.26)] 2018 13th International Congress Molded Interconnect Devices (MID) - Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental Testing

The file will be sent to your email address. It may take up to 1-5 minutes before you receive it.

The file will be sent to you via the Telegram messenger. It may take up to 1-5 minutes before you receive it.

Note: Make sure you have linked your account to Z-Library Telegram bot.

The file will be sent to your Kindle account. It may take up to 1–5 minutes before you receive it.

Please note: you need to verify every book you want to send to your Kindle. Check your mailbox for the verification email from Amazon Kindle.