[IEEE 2018 19th International Conference on Electronic...

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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Micropyramid silicon wafer with ZnO nanowires as high efficiency piezoelectric nanogenerator

Yu, Xuecheng, Zhang, Leicong, Jiang, Wen, Zhu, Pengli, Zheng, Hairong, Sun, Rong, Wong, Ching-Ping
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Year:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480670
File:
PDF, 3.46 MB
english, 2018
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