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IEEE Transactions on Device and Materials Reliability 2018

Effects of Copper Migration on the Reliability of Through-Silicon Via (TSV)

Chan, Jiawei Marvin, Lee, Kheng Chooi, Tan, Chuan Seng
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Year:
2018
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2018.2880286
File:
PDF, 1.13 MB
english, 2018
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