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Elevated Temperature Behavior of CuPb18SbTe20/Nano-Ag/Cu Joints for Thermoelectric Devices
Jayachandran, B., Gopalan, R., Dasgupta, T., Sivaprahasam, D.Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-018-6789-1
Date:
November, 2018
File:
PDF, 2.01 MB
english, 2018