[IEEE 2018 13th International Congress Molded Interconnect Devices (MID) - Würzburg, Germany (2018.9.25-2018.9.26)] 2018 13th International Congress Molded Interconnect Devices (MID) - Development of LS-LDS combined process and material enabling simultaneous activation during additive manufacturing process
NIINO, Toshiki, WATANABE, Tetsuya, Mori, MikiYear:
2018
Language:
english
DOI:
10.1109/ICMID.2018.8527049
File:
PDF, 283 KB
english, 2018