[IEEE 2018 IEEE International Symposium on the Physical and...

[IEEE 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2018.7.16-2018.7.19)] 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - A Study for the Effectiveness of Wire Bond Process Parameters on AI-Cu Intermetallic Compound Distributions and the Correlation between Bonded Ball Adhesions and IMC Coverage

Chen, Ying Sian, Lee, Ming Tsung, Liu, Nicolas, Liu, Kevin

How much do you like this book?

What’s the quality of the file?

Download the book for quality assessment

What’s the quality of the downloaded files?

Year:

2018

Language:

english

DOI:

10.1109/IPFA.2018.8452500

File:

PDF, 5.13 MB

english, 2018

Conversion to is in progress

Conversion to is failed