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[IEEE 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2018.7.16-2018.7.19)] 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Evaluation of the Thermal Properties for the Design of the Semiconductor Device
Endoh, Ryo, Hashimoto, HidekiYear:
2018
Language:
english
DOI:
10.1109/IPFA.2018.8452597
File:
PDF, 522 KB
english, 2018