[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Thermal conductivity of epoxy resin using molecular dynamics simulation
PI, Bensong, YU, Huiping, QIN, Fei, CHEN, Pei, CAI, AnwenYear:
2018
Language:
english
DOI:
10.1109/icept.2018.8480468
File:
PDF, 6.10 MB
english, 2018