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[ASME ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - San Francisco, California, USA (Monday 27 August 2018)] ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by QDs@Silica-on-Chip Structure

Xie, Bin, Liu, Haochen, Sun, Xiao Wei, Yu, Xingjian, Wang, Kai, Luo, Xiaobing
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Year:
2018
Language:
english
DOI:
10.1115/IPACK2018-8301
File:
PDF, 4.08 MB
english, 2018
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