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Processing and integration of graphene in a 200 mm wafer Si technology environment
Lisker, M., Lukosius, M., Fraschke, M., Kitzmann, J., Dabrowski, J., Fursenko, O., Kulse, P., Schulz, K., Krüger, A., Drews, J., Schulze, S., Wolansky, D., Schubert, A.M., Katzer, J., Stolarek, D., CoLanguage:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2018.11.007
Date:
November, 2018
File:
PDF, 1.32 MB
english, 2018