Optical and thermal properties of flip-chip LED bulbs using chip-scale package
Jiang, Nan, Zou, Jun, Li, Wenbo, Yang, Bobo, Wang, Liping, Li, Mengtian, Liu, YimingVolume:
1074
Language:
english
Journal:
Journal of Physics: Conference Series
DOI:
10.1088/1742-6596/1074/1/012002
Date:
September, 2018
File:
PDF, 980 KB
english, 2018