Investigation on the Interfacial IMCs Layer of Sn-58Bi/Cu...

IOP Conference Series Earth and Environmental Science 2018 / 07 Vol. 170

Investigation on the Interfacial IMCs Layer of Sn-58Bi/Cu Solder Joints

Qu, Min, Cao, Tianze, Cui, Yan, Liu, Fengbin, Jiao, Zhiwei
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Volume:
170
Language:
english
Journal:
IOP Conference Series: Earth and Environmental Science
DOI:
10.1088/1755-1315/170/4/042066
Date:
July, 2018
File:
PDF, 939 KB
english, 2018
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