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Characteristics of Thin Cu Films Electrodeposited On Textured Ni-Co Substrates
Panda, B, Ray, R K, Kumar, RakeshVolume:
375
Language:
english
Journal:
IOP Conference Series: Materials Science and Engineering
DOI:
10.1088/1757-899X/375/1/012004
Date:
June, 2018
File:
PDF, 606 KB
english, 2018