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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Thermal Stress Analysis and Design Guidelines for Through Silicon Via Structure in 3D IC Integration
Zhang, Yuanxiang, Wang, Jiankun, Yu, SijiaYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480433
File:
PDF, 4.10 MB
english, 2018