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[ASME ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - San Francisco, California, USA (Monday 27 August 2018)] ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Measurement of the Thermal Performance of a Single-Phase Immersion Cooled Server at Elevated Temperatures for Prolonged Time
Bansode, Pratik V., Shah, Jimil M., Gupta, Gautam, Agonafer, Dereje, Patel, Harsh, Roe, David, Tufty, RickYear:
2018
Language:
english
DOI:
10.1115/IPACK2018-8432
File:
PDF, 1.11 MB
english, 2018