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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Development on Super-thin & High-Pixel CMOS Image Sensor Module
Huang, Mark, Han, Huisheng, Wu, Huabin, Huang, Chuangwen, Zhang, WeiqingYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480525
File:
PDF, 2.43 MB
english, 2018