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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Research on Thermal Analysis of Iris Recognition Module Package Structure
Yang, Zhangping, Yang, Daoguo, Wang, Lei, Wang, Xiyou, Cai, MiaoYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480569
File:
PDF, 3.49 MB
english, 2018